Sixth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2026)

November 16–19, 2026, Tempe, Arizona, USA

Scope

Sixth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2026) brings together researchers, engineers, industry professionals, and technology innovators to discuss advances in power electronics packaging, integration, and manufacturing. The symposium focuses on developments in 3D circuits, advanced packaging, heterogeneous integration, power electronics systems, and manufacturing technologies. It provides an international forum for sharing research, industrial experiences, technical innovations, and emerging solutions for next-generation power electronics.

Researchers and practitioners from academia and industry are invited to participate and share their work on advanced materials, thermal management, modeling and simulation, reliability, passive components, power delivery, and energy storage technologies.

Topics of Interest

• Advanced Packaging and 3D Integrated Modules
• 3D, 2.5D, and 2D Advanced Packaging Technologies
• Wafer-Level Packaging and Module Integration
• Bonding and Manufacturing Technologies
• Materials for Advanced Packaging and Heterogeneous Integration
• Wide-Bandgap (WBG) Materials and Semiconductor Technologies
• Thermal Management and Advanced Cooling Technologies
• Design, Modeling, and Multiphysics Simulation
• Artificial Intelligence and Machine Learning for Power Electronics
• Reliability Engineering and Failure Analysis
• Prognostics and State-of-Health Monitoring
• Passive Components, Inductors, Transformers, and Capacitors
• Power Delivery Networks and Vertical Power Delivery
• Integrated Energy Storage and Energy Harvesting
• Power Electronics Integration and Manufacturing Innovations

Abstract Submission

Authors interested in presenting their research are invited to submit poster abstracts through the official Abstract Submission System . The poster abstract submission deadline is October 31, 2026 . Abstracts should describe relevant technical contributions in 3D power electronics integration, advanced packaging, materials, thermal management, modeling, reliability, and manufacturing technologies. Authors should consult the official website for submission instructions, abstract templates, presentation requirements, and the latest updates.

Authors wishing to publish full papers in the IEEE Xplore conference proceedings should consult the official symposium website for the applicable publication guidelines and submission requirements.

Important Dates

Poster Abstract Submission Deadline: October 31, 2026
Symposium Dates: November 16–19, 2026
Location: Tempe, Arizona, USA

Conference Details

• Symposium: Sixth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2026)
• Date: November 16–19, 2026
• Venue: ASU SkySong Complex, Tempe/Scottsdale, Arizona, USA
• Host: Arizona State University (ASU)
• Website: https://www.3d-peim.org/
• Abstract Submission: Poster Abstract Submission System

Contact Us

For further information about the symposium, abstract submission, registration, and participation, please visit the official website and contact the organizing committee through its published contact details.

Website: https://www.3d-peim.org/
Abstract Submission: Submit Poster Abstract