2027 Pan Pacific Strategic Electronics Symposium

Pan Pacific 2027

Call For Papers

The 2027 Pan Pacific Strategic Electronics Symposium (Pan Pacific 2027) will take place from January 25–28, 2027, at the Sheraton Maui Resort & Spa in Maui, Hawaii, USA. Organized by the Surface Mount Technology Association (SMTA), the symposium brings together electronics industry leaders, researchers, engineers, manufacturers, and technology professionals to discuss emerging technologies, advanced manufacturing processes, materials, reliability, and future directions in the electronics industry.

Pan Pacific 2027 provides a forum for exchanging technical knowledge and industry perspectives on strategic electronics technologies. The symposium encourages contributions addressing innovations in electronics manufacturing, semiconductor packaging, materials science, reliability engineering, high-reliability electronic systems, and evolving industry roadmaps. Researchers and industry professionals are encouraged to consult the official symposium website for abstract submission requirements and presentation opportunities.

Topics of Interest Include:

• Advanced Electronics Packaging and Processes
• Heterogeneous Integration
• Interposer Technologies
• Nanotechnology Applications in Electronics
• Semiconductor Packaging and Manufacturing
• Advanced Materials for Electronic Assemblies
• Cleaning Technologies for Electronics Manufacturing
• Electronic Component Reliability
• Inspection and Failure Analysis
• Reliability Testing and Quality Assurance
• Automotive Electronics
• High-Reliability Electronic Systems
• Electronics for Extreme Thermal Environments
• Mission-Critical Electronic Applications
• Surface Mount Technology and Assembly Processes
• Electronic Manufacturing Innovations
• Emerging Semiconductor Technologies
• Electronics Industry Trends and Technology Roadmaps
• Global Electronics Manufacturing and Supply Chains
• Sustainable Electronics Manufacturing
• Advanced Interconnect Technologies
• Materials Characterization and Process Optimization
• Thermal Management of Electronic Components
• Emerging Technologies in Microelectronics

Paper Submission

Researchers, engineers, academics, and industry professionals interested in presenting their work are invited to consult the official Pan Pacific 2027 Call for Abstracts. The symposium focuses on technical contributions and industry developments in strategic electronics, electronics manufacturing, advanced packaging, materials, reliability, and related technologies.

Prospective presenters should review the official submission instructions for abstract preparation, submission requirements, presentation formats, and acceptance procedures. The published abstract submission deadline is November 15, 2026. Please refer to the official symposium website for the current submission status and any updated instructions.

Submission Link: Pan Pacific 2027 Call for Abstracts

Important Dates

• Abstract Registration Due: 2026-11-15
• Submission Deadline: 2026-11-15
• Notification Due: N/A
• Final Version Due: N/A

Publication

The symposium features technical presentations and discussions addressing current challenges and innovations in electronics manufacturing and strategic electronics. Information about technical proceedings, presentation requirements, and any publication or indexing arrangements should be confirmed through the official SMTA symposium website.

Contact Us

For inquiries regarding abstract submissions, technical presentations, registration, participation, sponsorship, and other symposium-related matters, please contact the Surface Mount Technology Association (SMTA).

Email: Contact SMTA through the official symposium website

Organization Email: info@smta.org

Conference Website: https://smta.org/mpage/panpac