57th IEEE Semiconductor Interface Specialists Conference (SISC 2026)

December 9-12, 2026, San Diego, California, USA

Scope & Topics

57th IEEE Semiconductor Interface Specialists Conference (SISC 2026) is a workshop-style conference that brings together device engineers, solid-state physicists, materials scientists, researchers, and industry professionals to discuss developments in semiconductor interfaces, materials, devices, and reliability.

The conference focuses on the role of materials, interfaces, and defects in the performance and reliability of advanced semiconductor devices and technologies.

SISC 2026 provides a forum for invited and contributed presentations, poster sessions, and technical discussions covering emerging semiconductor technologies, advanced materials, device physics, and reliability.

Topics of Interest include, but are not limited to:

• Semiconductor and Insulator Interfaces
• Semiconductor Device Physics
• Physics of Insulating Thin Films
• Materials Science and Semiconductor Devices
• Logic Devices for Future Technology Nodes
• Nanosheet Devices
• CFET and VFET Technologies
• Insulators on High-Mobility Substrates
• SiGe and Ge Semiconductor Technologies
• Non-Volatile Memory Devices
• AI and In-Memory Computing
• Neuromorphic Computing
• ReRAM, PCM and ECRAM Technologies
• Wide Bandgap Semiconductor Power Devices
• SiC and GaN Devices
• β-Ga2O3 Semiconductor Devices
• Ferroelectric Devices
• FeFET and FeRAM Technologies
• Steep Sub-Threshold Slope Logic Devices
• Tunnel FETs
• Low-Dimensional Materials and Devices
• Two-Dimensional Semiconductor Devices
• Monolithic and Heterogeneous Integrated Circuits
• BEOL Oxide Transistors
• Semiconductor Interconnects
• Advanced Packaging
• Device Reliability
• Interface Defects and Reliability
• Materials and Interface Engineering
• Advanced Semiconductor Materials
• Machine Learning for Materials Discovery
• Machine Learning for Semiconductor Research
• Materials Discovery Techniques
• Emerging Semiconductor Technologies

Paper Submission

Researchers, academics, engineers, and industry professionals are invited to submit original work related to semiconductor interfaces, materials, device physics, reliability, and emerging semiconductor technologies.

The SISC conference accepts contributed presentations and poster presentations covering theoretical and experimental research on the role of materials, interfaces, and defects in semiconductor device performance and reliability.

Abstract submissions should follow the conference submission requirements. The extended abstract should be prepared in PDF format and should not exceed two pages, including figures and references.

Conference Program

SISC 2026 will include invited presentations from industry and academia, contributed technical presentations, poster sessions, and a Wednesday evening tutorial.

The technical program will cover advanced semiconductor devices, semiconductor interfaces, materials, reliability, non-volatile memory, wide bandgap devices, ferroelectric devices, low-dimensional materials, heterogeneous integration, and machine learning for materials discovery.

The conference will be held as a fully in-person event, providing opportunities for researchers, students, device engineers, materials scientists, and industry professionals to exchange ideas and discuss emerging semiconductor technologies.

Important Dates