IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2026)

August 5 - 7, 2026
Northwestern University, Evanston, Illinois, USA

Scope and Topics

The IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2026) is the premier international forum for presenting innovative research in all aspects of low power electronics and design. The symposium brings together researchers, engineers, industry professionals and academicians working on process technologies, analog and digital circuits, system architecture, EDA tools, embedded software, AI hardware, quantum computing and emerging low-power technologies.

Authors are invited to submit original, unpublished research papers describing significant innovations, practical developments and emerging research in low-power electronic systems and design methodologies.

Call for Papers

ISLPED 2026 solicits original contributions in all areas of low-power electronics and design. Accepted papers will be presented during the symposium and published in the IEEE Xplore Digital Library and ACM Digital Library.

Topics of Interest include but are not limited to

Track 1 : Technology, Circuits and Architecture
• Low-power semiconductor technologies
• Memory technologies
• Logic and interconnect optimization
• 2.5D / 3D integration
• Power-efficient analog and mixed-signal circuits
• Clocking and reliability
• Energy harvesting
• Biomedical electronics
• AI-assisted circuit optimization
• Power-efficient AI architectures
• Microarchitecture optimization
• Processor and SoC design
• Cache and memory architecture
• Signal processing hardware
• Cryptographic hardware
• Asynchronous computing

Track 2 : EDA, Systems and Software
• CAD tools for low-power design
• Thermal-aware optimization
• AI/ML for EDA automation
• Power estimation methodologies
• Reliability-aware optimization
• Embedded systems
• Internet of Things (IoT)
• Wearable computing
• Wireless sensor networks
• Data center power optimization
• Hardware/software co-design
• Energy-aware scheduling
• Low-power operating systems
• Hardware security
• PUF and TRNG
• Post-quantum cryptography
• AI security

Track 3 : AI/ML, Quantum and Emerging Hardware
• Analog AI accelerators
• Mixed-signal AI hardware
• Compute-in-memory
• Neuromorphic computing
• Spiking Neural Networks
• ReRAM and Memristor technologies
• Photonic computing
• Digital AI accelerators
• Systolic arrays
• Tensor Processing Units
• FPGA-based AI systems
• GPU optimization
• Memory hierarchy optimization
• Sparse computation
• RTL design for AI hardware
• Compiler support for AI accelerators
• Quantum computing hardware
• Quantum algorithms
• Quantum circuit optimization
• Hybrid quantum-classical computing
• Emerging computing technologies

Track 4 : Industrial Design Track
• Industrial-scale low-power chip design
• Commercial SoC implementations
• Industrial design methodologies
• Real-world implementation challenges
• Lessons learned from industrial products

Paper Submission

Authors are invited to submit original full-length papers in PDF format using the ACM conference template. Papers should not have been previously published or be under review elsewhere. Accepted papers will be published in the IEEE Xplore Digital Library and ACM Digital Library.

Important Dates

Organizing Committee

• General Co-Chairs: Younghyun Kim (Purdue University)
• General Co-Chairs: Srividhya Venkataraman (AMD)
• Technical Program Co-Chairs: Mehdi Kamal (University of Southern California)
• Technical Program Co-Chairs: Aatmesh Shrivastava (Northeastern University)
• Treasurer: Shahin Nazarian (University of Southern California)
• Local Arrangements: Jie Gu (Northwestern University)
• Local Arrangements: Amit Trivedi (University of Illinois Chicago)
• Publications Chairs: Xue Lin (Northeastern University)
• Publications Chairs: Sudhanshu Khanna (Texas Instruments)
• Publicity Chair: Jinho Lee (Seoul National University)
• Industrial Liaison: Adam Teman (Bar-Ilan University)

Technical Sponsors

• IEEE Council on Electronic Design Automation (CEDA)
• ACM Special Interest Group on Design Automation (SIGDA)
• ACM Special Interest Group on Microarchitecture (SIGMICRO)

Publication

Accepted papers will be included in the IEEE Xplore Digital Library and the ACM Digital Library. Selected papers will be invited to submit extended versions to IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Conference Website

https://islped.org/2026/