Advances in Interconnect Technologies: An International Journal (AITIJ)
Scope & Topics
Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.
Research areas suitable for publication include, but are not limited to the following fields:
Topics of interest include but are not limited to, the following
- Emerging Materials
- CNT/ Graphene Interconnects
- Modeling and Simulation
- Testing
- RFIC
- Optical Interconnects
- Wireless Interconnects
- Microstrip Lines
- Analog and Mixed Signals
- Dedicated Software and Systems for Developing Interconnect Technology
- On-Chip and Off-Chip Interconnects
- EMC/EMI
- FPGA/ASICs
- Fabrication Techniques
- Neural Networks
- Parasitics Issues
- Optimization Techniques
Paper Submission
Authors are invited to submit papers for this journal through E-mail: aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.
Important Dates
| Submission Deadline | : | October 26, 2026 |
| Authors Notification | : | November 26, 2026 |
| Final Manuscript Due | : | December 03, 2026 |
| Publication Date | : | Determined by the Editor-in-Chief |
Related Journal
Editor in Chief
Editorial Board
- Alex Orailoglu, California Institute for Telecommunications and Information Technology, USA
- Alpana Agarwal, Thapar University, India
- Anamika Ahirwar, Rajiv Gandhi Technical University, India
- Arputha Rathina, B. S. Abdur Rahman University, INDIA
- Azita Emami, California Institute for Telecommunications and Information Technology, USA
- Brajesh Kumar Kaushik, Indian Institute of Technology Roorkee, India
- T. D. Dongale, Shivaji University, INDIA
- Fatih Korkmaz , Cankiri Karatekin University, Turkey
- Gargi Khanna, National Institute of Technology Hamirpur, India
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Posted 30-11-2022 on 22:08:32
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